Will be responsible for managing group of engineers that design and simulate our packages as well as manage our package and assembly partners. Will also be interfacing with the various design groups to develop the best technical packaging solutions with the optimal cost structure. Good project management skills will be required. Good communication skills required. Must have the ability to work with chip and board design groups to analyze signal integrity for products being designed.
Education Requirement or Equivalent:
Minimum BSEE/BSME, or equivalent, with 10+ years technical experience in Package Design and Development.
Experience Requirement:
The candidate will need to have 10+ years of progressively increasing responsibility in the Packaging Design and Development area. Must have experience managing a design and simulation group for advanced high performance packaging. Must have a proven track record of shipping wirebond, flip-chip, plastic, ceramic, CSP, SiP, and PoP products in volume.
Special Skills or Knowledge Required:
Should be familiar with Ansoft TPA, HFSS, Q3D, SIWave, Sigrity PowerSI. Agilent ADS, Flomerics Flotherm, and Cadence Allegro. Experience with >20GHz package design a plus. Must be able to use Microsoft Project to plan and track projects.
(Dept: : 445 - Package, Req#: 3238)
Posted: 8/27/2008
To be considered for an open position at AMCC, please send your resume to jobs@amcc.com. Be sure to include the word "resume" in the subject line.
