Electronic packaging serves a critical purpose to the functionality of integrated circuits. Learn about the design process of electronic packaging and participate on a team to develop new electronic packages for high speed digital applications. Successful candidates will be comfortable interacting with and influencing cross-functional engineering teams including digital designers, analog designers, layout engineers, quality/reliability, and product/test engineers. Simulate RF and high frequency designs using Ansoft HFSS. Produce mechanical assembly drawings for new products.
Education Requirement or Equivalent:
Minimum Junior or Senior BSEE/BSME candidate, or MSEE/MSME candidate.
Experience Requirement:
Minimum 0-3 years experience using mechanical CAD programs, knowledge of analog or high frequency digital design, and PCB layout tools. Working knowledge of Microsoft Office.
Special Skills or Knowledge Required:
Experience with Ansoft HFSS, Cadence PCB layout tools, and AutoCAD a plus.
(Dept: : 445 - Package, Req#: 3301)
Posted: 8/27/2008
To be considered for an open position at AMCC, please send your resume to jobs@amcc.com. Be sure to include the word "resume" in the subject line.
